Sharing a common form factor for accelerator modules
Mar 14, 2019Whitney Zhao

Summary
This post introduces the OCP Accelerator Module (OAM) as a common form factor specification for hardware accelerators (GPUs, FPGAs, ASICs, etc.) used in AI and high-performance computing. It addresses the limitations of existing form factors like PCIe CEM by providing a more optimized solution for high bandwidth, interconnect flexibility, and power scalability. The OAM specification includes details on power input (12V/48V), TDP support, dimensions, link configurations, and support for various interconnect topologies like hybrid cube mesh and fully connected. Meta has contributed this specification to the Open Compute Project community to foster open collaboration and innovation.
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